Services > Assembly Services
Capabilities:
Assembly Services
Capabilities:
- Board Size 22"x22"
- SMT 0201 capability
- Ultra-Fine Pitch
- PBGA, CBGA, TBGA, CGA
- uBGA .4mm pitch
- Flex Circuits
- Programming of IC's
- Automated Conformal Coating / Potting
- No-Clean Soldering
- Lead-Free RoHs compliant processing
System level assembly:
- Electro-Mechanical assembly
- Backplanes
- Higher-level Assemblies
- Cabling
- Electro-Mechanical assembly
- Backplanes
- Higher-level Assemblies
- Cabling
Acceptable file formats for this system are .jpg, .gif, .bmp, .tif, .pdf, .xls, .doc, .cad, .dxf, .dwg, & Gerber 274 & 274x.
To access this system, you must have a valid username and password. If you've forgotten your username or password, or need to send files in a format other than those listed, please contact your Conelec representative.



